MPA stands for Mirror Projection Mask Aligner which is made up of mirror. MPA avoid mask damage due to adhesion to wafer.
MPA500FA is not almost used now. Max wafer size is φ5 inch. This model is original and added function later.
| MPA500FA | MPA500FA is not almost used now. Max wafer size is φ5 inch. This model is original and added function later. |
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| MPA500FAb | MPA500FAb is a succeeding version of MPA500FA. Inside of main body, temperature control of wafer chuck, transfer hand back side carriage and accuracy of auto alignment are improved. DR air adjustment function is added. These improved and added functions are standard specification of MPA600FA. Max wafer size is φ5 inch. |
| MPA600FA | MPA600FA is a succeeding version of MPA500FAb. Max wafer size is φ6 inch. There are 2 types of auto alignment selectable. Illumination stability and resolution are improved by modification of illumination system. |
| MPA600Super | MPA600Super is a succeeding version of MPA600FA. TV auto alignment is added. LAB is driven by linear motor. PDC is automated. MPA600Super is last model of aligner for semiconductor. |
PLA is aligner which radiates parallel rays from upside of mask with wafer and mask adhere and then pattern wafer. Wafer size is φ2 to 6. PLA features are small footprint and having various functions. For example there are 3 kinds of alignment mode selectable as following.
